Welcome Guest

 

Home | Proceedings | Calendar | Google
 

Good News:Please download more conference photo.

2013.11.1 Good News: All papers accepted by 2nd ICMDME2013 have been successfully indexed by EI Compendex. You are welcome to submit your papers to the 3rd ICMDME2014.
好消息:第二届ICMDME2013所有文章均已成功被EI检索!欢迎大家继续支持ICMDME2014!

2013.5.23 Good News: The same conference committee will organize another conference 2nd ICIDMP 2013.You can find more information during the website: www.icidmp.org.

消息:同一组委会举办的另一国际会议:2013年第二届工业设计与机械动力国际会议将于8月24-25日在南京召开,欢迎广大作者踊跃投稿!会议网站:www.icidmp.org.

2013.5.23 Good News:Dear authors,TTP upload system has been closed,so you can't find your paper via this system.Please wait for a few weeks to find your online paper.Latest news will be listed on the website.

消息:作者您好:TTP上传系统已经关闭,文章进入排版阶段,因此您不能通过登录账户来找到您的文章。请您耐心等待您的文章电子版上线!最新消息将会在网站上列出!

2013.5.6 Good News: Thank you very much for your contribution to 2nd ICMDME 2013! Username and Password has been sent to your email(email in registration form).Please upload your final version manuscript(both .doc and .pdf file)and copyright agreement(.pdf), fill in the paper information including (Paper Title, Abstract,Authors,Keywords.etc) and Checklist strictly to TTP System before May 13,2013.

感谢您对2nd ICMDME 2013的大力支持!TTP上传用户名及密码已经发送至您注册表中的邮箱,请您注意查收!请没有收到用户名及密码的作者尽快与我们联系,我们将重新为您发送!TTP上传系统将于2013年5月13日晚18点之前关闭,请您务必抓紧时间完成上传!

2013.5.2 Good News:2nd ICMDME 2013has been successfully held in Jeju Island,South Korea!For More Photo pleaseclick.中国作者可访问会议相册下载更多原图.

2013.04.15 Good News: The final version of ICMDME 2013 Conference Schedule is Ready for download .

2013.04.15 Good News: 2013.04.15 Good News: The last round Notification of acceptance will be sent to authors who submitted conference paper before April.11 in April.15-April.17, please check your email and finish registration before April.22, 2013.If you didn’t receive any notification, please contact us by email! Tel: +86-24-83958379-801.Registration process will start accordingly.

好消息:最后一轮录用通知将于4月15日至4月17日陆续发送至作者邮箱,请4月11日之前投搞的作者查看邮箱。同时,会议注册也已经开始,请作者务必于4月22日之前完成注册。如有任何问题,请随时与我们联系!电话:024-83958379-801

, please check your email and finish registration before April.22, 2013.If you didn’t receive any notification, please contact us by email! Tel: +86-24-83958379-801.Registration process will start accordingly.

好消息:最后一轮录用通知将于4月15日至4月17日陆续发送至作者邮箱,请4月11日之前投搞的作者查看邮箱。同时,会议注册也已经开始,请作者务必于4月22日之前完成注册。如有任何问题,请随时与我们联系!电话:024-83958379-801

2013.04.10 News:The deadline of ICMDME 2013 is 24:00,April.11,2013.Please send your paper to us asap.

消息:投稿截止日期为4月11日晚24点,请未投稿的作者抓紧时间!

2013.04.02 Good News: Notification of acceptance has been sent to authors who submitted conference paper before March.25, please check your email and finish registration before April.10, 2013.If you didn’t receive any notification, please contact us by email! Tel: +86-24-83958379-801.Registration process will start accordingly.
好消息:第二轮录用通知已经发送至作者邮箱,请3月25日之前投搞的作者查看邮箱,同时,会议注册也已经开始。请作者务必于4月10日之前完成注册。如有任何问题,请随时与我们联系!电话:024-83958379-801.

2013.03.27 Good News:Considering most application for paper submission, the deadline is extended to April 11,2013! Thank you for all your attention and support to 2nd ICMDME2013! Please submit your paper as soon as possible! Notification of acceptance will send to author during April.17, 2013.
The notification of acceptance will be sent to authors who submitted conference paper before March.25 on April.2, 2013.

好消息考虑到广大作者的强烈要求,会务组决定将截稿日期延迟至4月11日,本轮征稿录用通知将于4月17日发放!名额有限,欲投从速!3月25日之前投稿的作者请注意:我们将于4月2日如期为您发送录用通知!

2013.3.14 Good News: 2nd ICMDME 2013 has been listed on TTP official website:http://www.scientific.net/conference-831.
TTP出版list(官方会议ID):http://www.scientific.net/conference-831.

2013.3.11 Good News:The first round notification of acceptance has been sent to authors who submitted conference paper before March 5, please check your email. If you get the notification, you are supposed to follow the instruction to finish registration before March.18, 2013.If you didn’t receive any notification, please contact us by email! Tel:+86-24-83958379-801. Registration process will start accordingly. The next round notification of acceptance will be sent to authors in early April.
好消息:2013年3月5日之前投稿的作者请注意查看邮件。第一轮录用通知已经发送到您的邮箱里。同时,会议注册也已经开始,请作者及时完成注册。如有任何问题,请随时与我们联系!电话:024-83958379-801

2013.02.26 Good News:The First round notification of acceptance will be sent to authors who submitted conference paper before March.5 on March.11, 2013.
好消息: 为方便广大作者办理相关出国手续,会务组将于3月11日(星期一)为3月5日之前投稿的作者发放录用通知!

2013.01.31 Good News:Prof. Dae-Eun Kim from Yonsei University,Korea will deliver Keynote Speech on 2nd ICMDME 2013!

NEWS: Happy New Year to everyone! We will have a holiday during Feb.1-Feb.15, 2013.You can contact us via cfp@icmdme.org !

2013.01.31 Good News:Prof.Bibhuti Bhusan Biswal from National Institute of Technology Rourkela, Orissa will deliver Keynote Speech on 2nd ICMDME 2013!

2013.01.31 Good News:Prof.Sachiko Nakagawa from Okayama University of Science will deliver Keynote Speech on 2nd ICMDME 2013!

2013.01.21 Good News: Welcome to submit your CV to apply for the committee member by the committees@icmdme.org

2013.01.05 Good News : All papers accepted by 1st ICMDME 2012 have been indexed by EI Compendex. You are welcome to submit your papers to the 2nd ICMDME 2013. 好消息:第一届ICMDME 2012所有文章均已被EI检索,2013年第二届ICMDME所有录用文章均被EI检索!2013年第二届ICMDME仍将在韩国济州岛举办,稿件征集已经全面启动,欢迎广大作者踊跃投稿!

PHOTO OF 1st ICMDME2012

 

2013 2nd International Conference on Machine Design and Manufacturing Engineering(ICMDME 2013) is being organized and will be held on 1st-2nd,May, 2013 in Jeju Island, South Korea.

The aim objective of 2nd ICMDME 2013 is to present the latest research and results of scientists (professors, students, PhD Students, engineers, and post-doc scientist) related to Machine Design and Manufacturing Engineering topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.

2nd ICMDME 2013, Technical sponsored by Trans Tech Publications, is supposed to be the largest technical event on Mechatronics and Applied Mechanics in Jeju Island, Korea. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to 2nd ICMDME 2013.

Proceeding of 2nd ICMDME 2013 will be published by in international journal " Applied Mechanics and Materials " [ISSN: 1660-9336,Trans Tech Publications]. Applied Mechanics and Materials is indexed by Elsevier: SCOPUS www.scopus.com and EI Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science)www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.http://www.ttp.net/1660-9336.html.The full text is online available via platform www.scientific.net. Trans Tech Publications will provide online camera-ready paper submission system.The full text is online available via platform www.scientific.net. Trans Tech Publications will provide online camera-ready paper submission system.

The organizing committee of 2nd ICMDME 2013 will recommend selected 180 excellent papers to published in International journals including

  • International Journal of Materials and Product Technology (IJMPT) ISSN (Online): 1741-5209-ISSN (Print): 0268-1900 (SCI)                            
  • International Journal of Manufacturing Technology and Management (IJMTM) ISSN (Online): 1741-5195-ISSN (Print): 1368-2148 (EI)
  • Int.of Materials and Structural Integrity(IJMSI) ISSN (online): 1745-0063-ISSN (print): 1745-0055 (EI)
  • Int.J.of Machining and Machinability of Materials(IJMMM) ISSN (online): 1748-572X-ISSN (print): 1748-5711 (EI)
  • Int.J.of Computational Materials Science and surface Engineering(IJCMSSE) ISSN (online): 1753-3473-ISSN (print): 1753-3465 (EI)

    If you want to your paper recommended to SCI/EI Journal. Please you should download and fill the application form “ICMDME 2013 Journal Recommendation Form". You are supposed to send your paper and this application form to cfp@icmdme.org .

    IJMPT is a refereed and authoritative publication which provides a forum for the exchange of information and ideas between materials academics and engineers working in university research departments and research institutes, and manufacturing, marketing and process managers, designers, technologists and research and development engineers working in industry.IJMPT is indexed by Elsevier: Science Citation Index (Thomson Reuters) ,Compendex (Elsevier) ,ABI/Inform (Proquest), Academic OneFile (Gale) , ANTE: Abstracts in New Technologies & Engineering (CSA) ,Business Source Premier (EBSCO), Business and Company Resource Center (Gale), CEABA-VtB [Chemical Engineering and Biotechnology Abstracts] (Dechema) ,Engineered Materials Abstracts (CSA) ,Expanded Academic ASAP (Gale) , General BusinessFile ASAP International (Gale) ,General OneFile (Gale) ,Google Scholar ,InfoTrac Custom Journals (Gale) ,Inspec (Institution of Engineering and Technology) ,Materials Business File (CSA) ,Metadex (CSA) ,RAM ,Scirus (Elsevier) ,Scopus (Elsevier).For index information,please refer to IJMPT official website:http://www.inderscience.com/www/absindexing/findjtitle.php?find=ijmpt

    IJMTM is a refereed and authoritative source of information in the field of manufacturing technology and management and related areas.IJMTM is indexed by Elsevier: Compendex (Elsevier), Business Source Premier (EBSCO),ABI/Inform (Proquest), Academic OneFile (Gale) , Business and Company Resource Center (Gale), DBLP Computer Science Bibliography, Ergonomics Abstracts (Taylor & Francis) ,Expanded Academic ASAP (Gale) , General BusinessFile ASAP International (Gale) ,General OneFile (Gale) ,Google Scholar ,Health and Safety Science Abstracts (CSA), InfoTrac Custom Journals (Gale) ,Inspec (Institution of Engineering and Technology) ,io-port (FIZ Karlsruhe),Materials Business File (CSA) ,Mechanical & Transportation Engineering Abstracts (CSA) , Metadex (CSA) ,Management and Marketing Abstracts (Pira International),Pascal (INIST-CNRS),RAM ,Risk Abstracts (CSA),Scirus (Elsevier) ,Scopus (Elsevier) etc.(For index information,please  refer to IJMTM official website:http://www.inderscience.com/www/absindexing/findjtitle.php?find=ijmtm)

    JNO is a cross-disciplinary peer-reviewed journal to consolidate all experimental and theoretical research activities in the areas of nanoscale electronic and optoelectronic materials and devices, electronic and optical properties of semiconductors, inorganic, organic, and hybrid nanostructures, electronic applications of superlattices, quantum structures, and other nanostructures, optoelectronic and photonic applications of novel functional materials and nanostructures, nanoelectronic circuits and device integration, nanofabrication, processing and characterization techniques, information processing and optical communications.

    JCTN publishes peer-reviewed research papers in all fundamental and applied research aspects of computational and theoretical nanoscience and nanotechnology dealing with chemistry, physics, materials science, engineering, and biology/medicine.

    IJMSI provides multidisciplinary approaches, either empirical or theoretical, to the study of materials and structural integrity. Its goals are to promote cross-fertilization of ideas between all the scientific disciplines having to deal with their own materials and structural integrity, including engineering, bionics, physics and chemistry. The journal encourages submission of new fundamental and interdisciplinary contributions on materials and structural integrity.

    IJMMM In modern manufacturing, there has been strong renewed interest in high-efficiency machining, while use of advanced materials has increased due to their special mechanical and physical properties. Advanced materials have replaced conventional materials in various fields of application including aeronautical, aerospace, automotive, biomechanical, mechanical and other industries. As a result of these properties and potential applications, there exists an urgent need to understand questions associated with the machinability of these materials. IJMMM addresses both machining and machinability of materials.

    IJCMSSE provides a blend of theoretical and applied study of computational materials science and surface engineering. Its scope includes original contributions on materials science and engineering, surface engineering, and computational methods of modelling, simulation and prediction for designing materials and structures at all length scales. The journal aims to address solutions to current engineering problems in which computational materials science and surface engineering methods must be applied, and to publish state-of-the-art reviews of current problems that will stimulate research.

What's New in Machine Design and Manufacturing Engineering

  Unmanned Aerial Vehicles Fly Via Additive Manufacturing
 
Case Study: Building Your Own 20kW Hydroelectric Power Plant
  China Is Not A "Market-Based Economy"
  CBI encourages Coalition to focus on manufacturers
  Cosworth named The Manufacturer of the Year 2011
  The Leading Source for Manufacturing News